Product Assurance-北京星灿智显科技有限公司

Five-Layer Inspection System
Building a “Zero-Defect” Product Quality Control Closed Loop

Xingcan Smart Display not only inspects products—we define the standards of reliability. Through a closed-loop quality system covering “Chip–Package–Module,” we transform uncontrollable risks into manageable data, fundamentally ensuring the ultimate stability and long-term quality of every module shipped from the factory.

Three-Tier Defect Inspection

Optoelectronic Performance Testing

85/85 Environmental Testing

Aging Test

Comprehensive Module Evaluation

Three-Tier Defect Inspection

At the wafer and chip stages, two rounds of high-precision AOI visual inspection enable megapixel-level defect detection, intercepting microscopic defects at an early stage; after packaging is completed, full-pixel-array scanning is performed to ensure that every chip meets stringent quality standards before integration. Triple Filtering, Leaving No Place for Defects to Hide.

Optoelectronic Performance Testing

Batch sampling is first conducted to verify consistency of optoelectronic performance, followed by 100% inspection and profiling of every selected LED device, generating independent optoelectronic parameter reports. The data is not only used for sorting optimization but also provides a scientific basis for subsequent module matching, fundamentally improving display uniformity.

85/85 Environmental Testing

Long-term stability testing is conducted under harsh conditions of 85°C temperature and 85% humidity, simulating high-temperature and high-humidity operating environments to ensure that chips and packaging structures maintain reliable performance under extreme conditions, extending product lifespan in outdoor and complex environments.

Aging Test

Through continuous power-on and cyclic load aging tests, long-term operating conditions in real-world applications are simulated. Potential early-life failures are proactively identified and eliminated, ensuring that every shipped module has already passed the test of time, with stable and reliable performance characteristics.

Comprehensive Module Evaluation

After module integration is completed, multidimensional testing is conducted on overall optoelectronic performance, color consistency, grayscale response, splicing performance, and other key parameters, ensuring that every shipped unit not only excels individually but also delivers outstanding performance in system-level integration.